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ESDI Issued and Pending Patents
 
 

ESDI is constantly developing state-of-the-art technologies for extreme metrology applications. Here are some of our exciting technologies that we have developed over the years. ESDI offers licensing of these patented technologies. Please contact us for details.


 Issued Patents
 
 
Full Hemispherical Real-Time Scatterometer
   
ESDI’s patented Q5 full Hemispherical real-time scatterometer images 3D scatter at 0.2 degrees resolution, with a dynamic range of 14 bits at video rates. All in a desktop package.
 
 
3D Real-Time Scatterometry
   
Invented by ESDI founder, Raymond Castonguay, this fused fiber optic bundle 3D light sensor, can acquire scattered light in real-time over a 45 degree cone at 0.1 degree resolution.
   
   
Small Beam Shearing Interferometer
   
ESDI’s patented duel shear plate design allows shearing of small beams without multiple reflection problems. For the first time, laser wavefronts as small as 1 mm diameter can be visualized unexpanded in real-time.
   
   
Phase-Shifting Point-Diffraction Interferometry
   
ESDI’s point-diffraction product technology utilizes an air pinhole in a half-wave plate polymer film. The result is a true common path self-referencing interferometer. When combined with ESDI’s HyperPhase™ technology, wavefront of laser beams can be measured dynamically in real-time.
   
   
   
   
 Pending Patents
   
   
External Dual Beam Simultaneous Phase Shifting Fizeau Interferometer
   

ESDI is the first company to file patents on external dual beam simultaneous phase shifting Fizeau interferometry. This technology allows true common path, coherent laser based interferometers to perform uncompromised dynamic vibration insensitive measurements in real-time.

Priority Date: November 27, 2002

   
   
Multi-Camera Simultaneous Phase Shifting
   

ESDI has filed patents for performing real-time common-path-length phase-shifting interferometry utilizing multiple cameras. The technology for beam-splitting, polarization phase-shifting and maintaining sub-pixel camera alignment is similar to high-end Three-Chip color cameras. The result is a highly rugged, high resolution, real-time phase measurement module that can be utilized in many types of interferometers and rugged environments.

Priority Date: November 27, 2002

 

 
   
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